VD1943CE RGB-IR Global shutter Camera Module

VD1943CE Camera Module

FOV

155°

81°

Module Size

13.20*13.20*26.25mm

13.20*13.20*23.13mm

Object Distance

49cm-INF

64.1cm-227.9cm

F/NO

2.0±5%

2.2±5%

EFL(Optical)

2.90mm±5%

4.2±5%

Lens Type

Glass

Glass+Plastic

Lens Construction

8G

3G+2P

Focus mode

Fixed  Focus

Data Interface

MIPI 2 or 4Lane

Power

2.8V/1.8V/1.15V

Operating temperature range

-30℃ to 85℃

Sensor Type

VD1943CE

Active Array Size

2560*1984

Pixel Size

2.25um*2.25um

Frame rates (maximum)

Full resolution:100fps

IR Filter

Clear/650nm/850nm/940nm(Optional)

Chippack develops custom camera products designed and built for customer application

Learn more detailshttps://www.st.com/en/imaging-and-photonics-solutions/cmos-image-sensors.html

 

1. Basic Parameters:

- Resolution: 2560 (H) x 1984 (V), 5.08MP sensor employing advanced technology, featuring both global and rolling shutter modes.

- Pixel Size: 2.25μm (H) × 2.25μm (V)

- Optical Format: 1/2.5 inch, equipped with advanced 3D stacked packaging and on-chip RGB-IR image separation.

- Power Supply Voltage: Core voltage 1.15V, interface voltage 1.8V, analog voltage 2.8V, enabling stable operation under different voltage conditions and ensuring sensor reliability.

- Temperature Range: Operating temperature -30℃ to 85℃, providing a wide operating temperature range to adapt to various working environments.

 

2. Technical Features:

- Global Shutter Technology: This sensor features both global and rolling shutter modes, allowing developers to optimize video shooting performance according to specific application requirements. This feature ensures motion artifact-free video capture (global shutter), low noise imaging, and high image detail (rolling shutter), making it ideal for high-speed object tracking and automated process image acquisition.

- Employing full-pixel packaging technology, this sensor utilizes 2.25 µm pixel technology and advanced 3D stacking packaging technology, resulting in a small size and high image quality. The die size is 5.76 mm x 4.46 mm, and the package size is 10.3 mm x 8.9 mm, achieving a pixel array area ratio of 73%, placing it at the forefront of the market. This compact design allows for integration into space-constrained embedded vision systems without compromising performance.

- The RGB-IR sensor series features on-chip RGB-IR separation, eliminating the need for external components to separate RGB and IR images, thus simplifying system design. This feature supports multiple output modes, including 5MP RGB-NIR 4x4, 5MP RGB Bayer, 1.27MP NIR subsampling, and 5MP NIR intelligent upsampling, with independent exposure time and instant output mode switching. This level of integration reduces application costs while maintaining full 5MP resolution in both color and infrared imaging.

- The sensor employs back-illuminated (BSI) and capacitive deep trench isolation (CDTI) pixel technology, enhancing the sensor's light sensitivity and image sharpness, particularly in low-light conditions. Single-frame on-chip HDR further improves the clarity of details in both bright and dark areas. These features enable high-quality imaging in challenging environments and support advanced machine vision and edge AI applications.

 

- The VD1943 RGB-IR image sensor is available in two versions: a 5.08MP Monochrome version (VD5943).

- VD1943 camera module: compatible with standard modules for various lens configurations such as 155° and 81°; meeting diverse customer needs.

 

3. Application Areas: For scenarios with stringent requirements regarding imaging quality, response speed, environmental adaptability, and size/power consumption, such as industrial automation, machine vision, smart security, traffic monitoring, smart retail, edge AI, and drone/robot vision, we provide highly reliable, mass-producible, and easily customizable embedded vision solutions. These are the preferred core modules for high-end industrial and AIoT imaging systems.

 

4. Personalized Customization Services: Customized modules can be manufactured to meet specific customer needs, creating products tailored to their individual requirements.