VD55H1CCA0 ITOF Camera Module

1. Basic parameters:

- Resolution: 672 (H) x 804 (V), 0.54MP ITOF camera module adopts back-illuminated (BSI) pixel array, which is the first product of its kind in the industry.

- Pixel size: 4.6μm (H) × 4.6μm (V), manufactured with back-illuminated fast photodiode pixels and advanced 40 nm stacked wafer technology; technologies such as multi-frequency operation, advanced depth unpacking algorithm and high pixel dynamic range ensure excellent measurement accuracy at long distances. Among them, the depth accuracy is better than 1%, and the typical accuracy is 0.1% of the distance.

- Optical format: 1/4 inch, combined with a 940 nm illumination system, it can build a small-size 3D camera to generate high-definition depth maps, with a typical full-resolution ranging distance of up to 5 meters and a pattern illumination distance of more than 5 meters.

- Power supply voltage: core voltage is 1.15V, interface voltage is 1.8V, analog voltage is 2.8V, pixel voltage is 1.5V, and it can work stably under different voltage conditions, ensuring the reliability of the sensor.

- Temperature range: The operating temperature is -30℃ to 85℃, with a wide temperature operating range, which can adapt to different working environments.

2. Technical features:

- VD55H1 is an indirect time-of-flight (IToF) sensor that calculates the distance to an object by measuring the phase shift between the reflected signal and the transmitted signal.

- VD55H1 uses a unique pixel structure and manufacturing process, and utilizes 40nm stacked wafer technology to ensure low power consumption, low noise and optimized chip area. It can contain 75% more pixels than existing VGA sensors in a smaller chip size.

- Supports capture sequences with a frame rate of up to 120 fps, improved motion blur robustness, and power consumption can be reduced to less than 100mW in specific streaming modes.

- VD55H1 camera module: compatible with standard modules with different lens configurations such as 108° and 68°; meet different customer needs.

3. Application areas:

-used in face unlocking, face recognition, gesture recognition, crowd detection, volume measurement, industrial robot recognition, intelligent palletizing, security monitoring, smart agriculture, factory automation and other fields.

4.Personalized customization service:

-Customized modules can be customized according to customer needs to tailor products to meet customers' needs.