VD55G0CCA1 Mono Global shutter Camera Module

VD55G0 Camera Module

FOV

158°

79°

Module Size

6.5*6.5*5.72mm

5.0*5.0*2.80mm

Object Distance

5.5cm-INF

13.5cm-INF

F/NO

2.0±5%

2.0±5%

EFL(Optical)

0.825±5%

1.32±5%

Lens Type

Plastic

Plastic

Lens Construction

5P

4P

Focus mode

Fixed  Focus

Data Interface

MIPI 1Lane

Power

2.8V/1.8V/1.15V

Operating temperature range

-30℃ to 85℃

Sensor Type

VD55G0CCB0

Active Array Size

644*604

Pixel Size

2.61um*2.61um

Frame rates (maximum)

Full resolution:185fps

IR Filter

Clear/650nm/850nm/940nm(Optional)

Support Customized Camera Module

Learn more details:https://www.st.com/en/imaging-and-photonics-solutions/cmos-image-sensors.html

 

1. Basic parameters:

- Resolution: 644 (H) x 604 (V), 0.38MP The device uses a three-dimensional stacked sensor, and the pixel structure minimizes crosstalk while achieving high quantum efficiency (QE) in the near-infrared spectrum.

- It uses 40 nm/65 nm technology, has 2.61 µm x 2.61 µm BSI pixels and full CDTI (capacitive deep trench), which is an excellent choice for high-performance imaging applications. .

- Optical format: 1/9 inch, the sensor measures only 1.67 x 1.57 mm², suitable for devices with large size restrictions such as AR/VR glasses or personal electronics.

- Supply voltage: The core voltage is 1.15V, the interface voltage is 1.8V, and the analog voltage is 2.8V. It can work stably under different voltage conditions, ensuring the reliability of the sensor.

- Temperature range: The operating temperature is -30℃ to 85℃, with a wide temperature operating range, which can adapt to different working environments.

2. Technical features:

- Global shutter technology: The global shutter design effectively eliminates motion blur and lighting artifacts, while reducing lighting power consumption requirements.

- VD55G0 supports automatic dark calibration, dynamic defect correction and mirror/flip readout functions, integrates temperature sensors, supports analog binning, 2x/4x binning and subsampling functions.

- VD55G0 adopts the third-generation advanced pixel technology, unique back-illuminated global shutter pixels, and uses STMicroelectronics chip stacking technology, which significantly improves product performance, size and system integration.

- VD55G1 camera module: compatible with standard modules with different lens configurations such as 158° and 79°; meet different customer needs.

3. Application areas:

-Applied in virtual reality/augmented reality, biometrics, drones, smart homes, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Personalized customization service:

-Customized modules can be customized according to customer needs to tailor products to meet customers' needs.