VD55G0CCA1 Mono Global shutter Camera Module
|
VD55G0 Camera Module |
||
|
FOV |
158° |
79° |
|
Module Size |
6.5*6.5*5.72mm |
5.0*5.0*2.80mm |
|
Object Distance |
5.5cm-INF |
13.5cm-INF |
|
F/NO |
2.0±5% |
2.0±5% |
|
EFL(Optical) |
0.825±5% |
1.32±5% |
|
Lens Type |
Plastic |
Plastic |
|
Lens Construction |
5P |
4P |
|
Focus mode |
Fixed Focus |
|
|
Data Interface |
MIPI 1Lane |
|
|
Power |
2.8V/1.8V/1.15V |
|
|
Operating temperature range |
-30℃ to 85℃ |
|
|
Sensor Type |
VD55G0CCB0 |
|
|
Active Array Size |
644*604 |
|
|
Pixel Size |
2.61um*2.61um |
|
|
Frame rates (maximum) |
Full resolution:185fps |
|
|
IR Filter |
Clear/650nm/850nm/940nm(Optional) |
|
|
Support Customized Camera Module |
||
| Learn more details:https://www.st.com/en/imaging-and-photonics-solutions/cmos-image-sensors.html | ||
1. Basic parameters:
- Resolution: 644 (H) x 604 (V), 0.38MP The device uses a three-dimensional stacked sensor, and the pixel structure minimizes crosstalk while achieving high quantum efficiency (QE) in the near-infrared spectrum.
- It uses 40 nm/65 nm technology, has 2.61 µm x 2.61 µm BSI pixels and full CDTI (capacitive deep trench), which is an excellent choice for high-performance imaging applications. .
- Optical format: 1/9 inch, the sensor measures only 1.67 x 1.57 mm², suitable for devices with large size restrictions such as AR/VR glasses or personal electronics.
- Supply voltage: The core voltage is 1.15V, the interface voltage is 1.8V, and the analog voltage is 2.8V. It can work stably under different voltage conditions, ensuring the reliability of the sensor.
- Temperature range: The operating temperature is -30℃ to 85℃, with a wide temperature operating range, which can adapt to different working environments.
2. Technical features:
- Global shutter technology: The global shutter design effectively eliminates motion blur and lighting artifacts, while reducing lighting power consumption requirements.
- VD55G0 supports automatic dark calibration, dynamic defect correction and mirror/flip readout functions, integrates temperature sensors, supports analog binning, 2x/4x binning and subsampling functions.
- VD55G0 adopts the third-generation advanced pixel technology, unique back-illuminated global shutter pixels, and uses STMicroelectronics chip stacking technology, which significantly improves product performance, size and system integration.
- VD55G1 camera module: compatible with standard modules with different lens configurations such as 158° and 79°; meet different customer needs.
3. Application areas:
-Applied in virtual reality/augmented reality, biometrics, drones, smart homes, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.
4. Personalized customization service:
-Customized modules can be customized according to customer needs to tailor products to meet customers' needs.